"Master in Intellectual Property,"  sponsored by the Chinese Government, for the year 2025.

The State Intellectual Property Office of the People's Republic of China (CNIPA), in collaboration with the Ministry of Education and the China Scholarship Council, and the General Directorate of Industrial Property (DPPI), invites and encourages all interested parties in the country to apply for the program: "Master in Intellectual Property," sponsored by the Chinese Government Scholarships, for the year 2025.

*The final deadline for document submission is April 30, 2025.
Call for Applications – Master’s Program in Intellectual Property (2026)

Within the framework of the cooperation between GDIP and the China National Intellectual Property Administration, applications are now open for the “Belt and Road Master Program on Intellectual Property,” funded by the Government of China.

Host Institutions:
The program is offered at prestigious universities in China, such as:

Tongji University (Shanghai) – a top-tier university with a strong focus on engineering and architecture
Zhongnan University of Economics and Law (Wuhan) – specialized in economics and law

The program is also supported by the Shanghai International College of Intellectual Property, an international center for intellectual property studies.

Program Details:

Degree: Master of Laws (LL.M)
Language: English
Duration: 2 years
Year 1: Studies in China
Year 2: Internship and thesis (defense online

Scholarship Benefits:

Tuition-free
Free accommodation (first year)
Monthly stipend (around 3000 CNY)
Health insurance

Career Opportunities after Graduation: Graduates may find employment in government institutions, international organizations, and companies in the field of intellectual property.

Application:
GDIP will select 1–2 candidates for this program.
Interested applicants are invited to send their applications to: info@dppi.gov.al

Application forms and required documents can be found in the link provided in GDIP’s official announcement.

Application Deadline: May 15, 2026

Documents

Annex 1

Annex 2

Annex 3

Annex 4

Annex 5

Invitation Letter_BRIPC Master Program